Modulus' deep expertise in ultra-miniaturization is unmatched in the industry. The demand for smaller and faster electronics has led to the use of miniaturized packaging of high density electronics. We use a number of different approaches to miniaturized packaging, ranging from Multi-Chip Modules (MCMs) to flex circuit technologies. Within our hybrid development process, we give strong consideration to many factors including:

• High reliability

• Electrical, mechanical and thermal stability

• Compactness - small size and light weight

• Small number of parts

• Resistance to shock and vibration

• Suitability for automation

Our approach to miniaturization always keeps manufacturability and testability as a foremost requirement.